Plasmatherm DRIE Study

A parameter study was conducted with the Plasmatherm. This is intended to help users tune there recipes based on the desired profile of the etch. Click on each parameter to view photos. A detailed spreadsheet with measurement will be published here soon.

 

Table 1: Parameters measured. Standard RIE Parameters

RF Power (W)	650, 750, 850, 950
Loops	10, 20, 30, 40, 50
Deposition Time (sec)	4, 5, 6, 7, 8
Etch Time (sec)	4, 5, 6, 7, 8

 

RF Power (W)

As the RF power is increased, the etch depth/rate increases then decreases, peaking at 850W. 

The initial increase in etch depth/rate is due to the higher energy of the reactive ions, which leads for more efficient material removal. The lower etch performance at higher power can be explain by several different phenomenon include; Ion deflection and scattering, aspect ratio-dependent etching, and charge buildup and deflections.

It seems that the 850W standard parameter is the most optimum. If a slower etch rate is needed, just decrease the RF power.

20 $\mu$m (3000 Magnification)

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650 W

750 W

850 W

950 W

10 $\mu$m (3000 Magnification)

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650 W

750 W

850 W

950 W

8 $\mu$m (4000 Magnification)

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650 W

750 W

850 W (3000)

950 W

7 $\mu$m (4000 Magnification)

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650 W

750 W

850 W (3000)

950 W

5 $\mu$m (4000 Magnification)

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650 W

750 W

850 W

950 W

3 $\mu$m (4000 Magnification)

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650 W

750 W

850 W

950 W

Loops

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20 $\mu$m (Varied Magnification)

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10 Loops (5000)

20 Loops (4000)

30 Loops (3000)

40 Loops (3000)

50 Loops (2000)

10 $\mu$m (Varied Magnification)

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10 Loops (5000)

20 Loops (4000)

30 Loops (3000)

40 Loops (2000)

50 Loops (2000)

8 $\mu$m (Varied Magnification)

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10 Loops (6000)

20 Loops (5000)

30 Loops (3000)

40 Loops (2000)

50 Loops (2000)

7 $\mu$m (Varied Magnification)

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10 Loops (6000)

20 Loops (5000)

30 Loops (3000)

40 Loops (2000)

50 Loops (2000)

5 $\mu$m (Varied Magnification)

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10 Loops (6000)

20 Loops (6000)

30 Loops (4000)

40 Loops (2000)

50 Loops (2000)

3 $\mu$m (Varied Magnification)

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10 Loops (6000)

20 Loops (8000)

30 Loops (4000)

Deposition Time (sec)

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20 $\mu$m (3000 Magnification)

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4 sec (2000)

5 sec

6 sec

7 sec

8 sec

10 $\mu$m (3000 Magnification)

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4 sec

5 sec

6 sec

7 sec

8 sec

8 $\mu$m (4000 Magnification)

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4 sec

5 sec

6 sec

7 sec (5000)

8 sec

7 $\mu$m (4000 Magnification)

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4 sec

5 sec

6 sec

7 sec (5000)

8 sec

5 $\mu$m (4000 Magnification)

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4 sec

5 sec

6 sec

7 sec (5000)

8 sec

3 $\mu$m (4000 Magnification)

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4 sec

5 sec

6 sec

7 sec (5000)

8 sec

Etch Time (sec)

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20 $\mu$m (3000 Magnification)

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4 sec

5 sec

6 sec

7 sec

8 sec

10 $\mu$m (3000 Magnification)

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4 sec

5 sec

6 sec

7 sec

8 sec

8 $\mu$m (4000 Magnification)

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4 sec

5 sec

6 sec

7 sec

8 sec (3000)

7 $\mu$m (4000 Magnification)

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4 sec

5 sec

6 sec

7 sec

8 sec (3000)

5 $\mu$m (4000 Magnification)

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4 sec

5 sec

6 sec

7 sec

8 sec

3 $\mu$m (4000 Magnification)

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4 sec

5 sec

6 sec